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The government has approved the proposal of the Ministry of Economic Development (MoED) to launch a Research, Development, and Innovation (R&D&I) project on chip-supporting ceramic base plate, allowing Hungary to enter the semiconductor manufacturing market. The government will support the capacity building with HUF 1 billion (EUR 2.64 M), the ministry announced – reports Járműipar.hu.
Gergely Fábián, State Secretary for Industrial Policy and Technology, said: “The shortage of chips during the coronavirus epidemic highlighted the vulnerability of the whole of Europe, while
Hungary currently has world-class materials research capabilities.
Building on this knowledge, access to the advanced technology market can significantly increase the competitiveness and sovereignty of the Hungarian economy, while at the same time significantly reducing the country’s international exposure.”
In order to advance the development and manufacturing capacities of the domestic chip-bearing ceramic base plates, the ministry has assessed the domestic R&D capabilities. The pilot project, which has been developed in several phases, shows that the manufacturing infrastructure can be built up in the medium term.
The state secretary added that the semiconductor business is characterized by rapid technological change, with R&D activities at all stages of the value chain being outstanding. Due to the extensive innovation activity,
the project and the subsequent developments will contribute significantly to the technological development of the Hungarian economy, to the processes of Industry 4.0 and to the technological transformation of industry,”
according to the statement.
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